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TDA7253L
6W AMPLIFIER WITH MUTING
1

FEATURES
WIDE SUPPLY VOLTAGE RANGE 6W @ VS = 20V, R L = 8, THD=10% MUTE FACILITY (POP FREE) WITH LOW CONSUMPTION AC SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION (150C
Figure 1. Package
SIP10

Table 1. Order Codes
Part Number Package SIP10 TDA7253L
2
DESCRIPTION
The TDA7253L is class AB audio power amplifier assembled in the Single in Line 10 pins Package.
Figure 2. Test and Application Circuit
R7 820 = MUTE SW CSVR 100F 3
+VS
C4 0.1F 9
C5 470F
C2 IN (L)
TDA7253L
5 7 R3 1.5K R4 47 C11 1000F
100nF 27K 4 6 CF
C9 0.1F R6 4.7
RL
47F
D02AU1429
September 2004
Rev. 2 1/8
TDA7253L
Table 2. Absolute Maximum Ratings
Symbol VS IO IO Ptot Top Tstg,Tj Supply Voltage Output Peak Current (repetitive f >20Hz) Output Peak Current (non repetitive, t = 100s) Total Power Dissipation (Tcase = 70C) Operating Temperature Range Storage & Junction Temperature Parameter Value 30 1.7 2 8 0 to 70 -40 to 150 Unit V A A W C C
Table 3. Thermal Data
Symbol Rth j-case Parameter Thermal resistance junction to case Max Value 9 Unit C/W
Figure 3. Pin Connection (Top view)
10 9 8 7 6 5 4 3 2 1 N.C. +VS N.C. OUTPUT GND NON INVERTING INPUT INVERTING INPUT SVR/MUTING N.C. N.C.
D02AU1430
Figure 4. Block Diagram
CFCOUP1
RFI 27K ININ+ 4 5 + 7 RF1 SVR 3 MUTE SC PROTECTION RF2 REFERENCES Tj
L
OUT
VS
9
TURN-ON AND OFF
TH PROTECTION
6
GND
D02AU1431
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TDA7253L
Table 4. ELECTRICAL CHARACTERISTCS (Refer to the test and application circuit, VS = 20V; RL = 8; Gv = 30dB; f = 1KHz; Tamb = 25C unless otherwise specified).
Symbol VS VO Iq PO d RI fL fH eN SVR VTMUTE VTPLAY AM IqMUTE Parameter Supply Voltage Quiescent Output Voltage Total Quiescent Current Output Power Total Harmonic Distortion Input Resistance Low Frequency Roll-off (-3dB) High Frequency Roll-off (-3dB) Total Input Noise Voltage Supply Voltage Rejection Mute Threshold Play Threshold Mute Attenuation Quiescent Current Mute CF C S VR 80 A Curve; RS = 10K f = 22Hz to 22KHz; RS = 10K RS = 10K; f = 100Hz; Vr = 0.5V 46 1 d = 10% d = 1% PO = 1W 5 4 100 Test Condition Min. 10 Typ. 9.5 30 6 5 0.03 200 40 80 2 2.5 60 1.6 4.5 100 6 10 10 60 Max. 24 Unit V V mA W W % K Hz KHz mV V dB V V dB mA
0.3
Note: to avoid pop-on noise -------------- 1
Figure 5. Output Power vs. Supply Voltage
POUT (W) f = 1KHz RL = 8 12
D02AU1432
Figure 7. Distortion vs Output Power
d%10 5 2 1 0.5
8 d = 10% d = 1% 4
0.2 0.1 0.05 0.02 f =1KHz
f =15KHz
0
0.01 100m
8 12 16 20 VS(V)
200m 300m
500m700m 1 Pout (W)
2
3
4
5 6 78
Figure 6. Quiescent Current vs. Supply Voltage
Iq (mA)
D02AU1433
45
40
35
30
25
20
8
12
16
20
VS(V)
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TDA7253L
Figure 8. PC Board Component Layout
Figure 9. Evaluation Board Top Layer Layout
Figure 10. Evaluation Board Bottom Layer Layout
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TDA7253L
3
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (R Th j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) 3.1 Example: VCC = 20V, Rload = 8ohm, RTh j-c = 9 C/W , Tamb max = 50C 2V cc Pdmax = (N channels) * -------------------------- + I q V c c 2 R lo ad Pdmax = 1 * ( 2.5 ) + 0.5 = 3W 150 - T am b max 150 - 50 (Heat Sinker) R Th c-a = ---------------------------------------- - R T h j-c = --------------------- - 9 = 24.3C /W 6 P d max In figure 8 is shown the Power derating curve for the device. Figure 11. Power Derating Curve
2
10
8 a) (a) 6 Pd (W) (c) 4 (d) 2 (b) b) c) d) Infinite Heatsink 10 C/ W 15 C/ W 20 C/ W
0 0 40 80 Tamb (C) 120 160
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TDA7253L
Figure 12. SIP10 Mechanical Data & Package Dimensions
DIM. A a1 B b1 b3 C c1 c2 D d1 e e3 L L1 L2 L3 L4 M N P 3.2 1 0.15 3.1 3 17.6 0.25 0.254 0.126 0.039 0.006 14.5 2.54 22.86 0.122 0.118 0.693 0.010 0.010 0.85 3.3 0.43 1.32 23.7 0.571 0.100 0.900 0.5 1.6 0.033 0.130 0.017 0.052 0.933 2.7 mm MIN. TYP. MAX. 7.1 3 24.8 0.020 0.063 0.106 MIN. inch TYP. MAX. 0.280 0.118 0.976 Weight: 2.02gr
OUTLINE AND MECHANICAL DATA
SIP10
D L3 c2
C
L1
N P
M d1
L2
a1
1
1
0
L4
L
b3 e3 B
b1 e c 1
SIP10
A
0016108 D
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TDA7253L
Table 5. Revision History
Date June 2003 September 2004 Revision 1 2 First Issue Changed Status and the graphic aspect in compliant to the new rules "Corporate Technical Pubblications Design Guide" Description of Changes
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TDA7253L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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